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Cooler Q1 Intel 1700 - 1U Passive RoHS

item no.: A 2727

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  • Description
  • Specs
  • Downloads
  • Related Products

  • LGA 1700
  • Recommend for Intel Alder Lake S Processor
  • Copper Heatsink with skiving fins for 1U Server
  • Up to TDP 125W
  • Shin-Etsu 7762 Pre-printed
  • SPECIFICATIONS:
    Application
    CPU Socket LGA1700
    CPU Recommend for Intel Alder Lake S Processor
    Solution Passive Copper Heatsink for 1U Server
    Technical Data
    Overall dimension 90 x 90 x 27 mm
    Weight 533.7g
    Heat Sink 
    Material Copper Heat Sink with Skiving Fins
    Fan
    Thermal grease Pre-Printed with SHIN-ETSU 7762