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Cooler R2 Intel 2011 - 1U Passive RoHS

item no.: A 2199

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  • Description
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  • Square type
  • 80 x 80mm mounting pitch
  • Intel® Sandy Bridge EP/EX Processors up to TDP 150 Watts
  • 1U&Up Solution
  • SPECIFICATIONS:
    Application
    Socket LGA2011
    CPU Intel® Sandy Bridge EP/EX Processors up to TDP 150 Watts
    Technical Data
    Overall dimension 90.0 x 90.0 x 27.0 mm
    Weight 435 g
    Heat Sink 
    Material Vapor Chamber Base with Copper Stacked Fin

    1. Support CPU Power up to 150 Watts
    2. Pre-print thermal compound Shin-Etsu G751
    3. RoHS Compliance
    4. Backplate is not included