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Cooler R17 Intel 2011 - 3U Active RoHS

item no.: A 1986

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  • Square type / 80 x 80mm mounting pitch
  • Intel® Sandy Bridge Romley-EP/EX Processors
  • TDP 160 Watts
  • 3U&Up, Workstation & Tower Desktop Solution
  • SPECIFICATIONS:
    Application
    Socket LGA2011
    CPU Intel® Sandy Bridge Romley-EP/EX Processors up to TDP 160 Watts
    Technical Data
    Overall dimension 91.0 x 91.0 x 110.0 mm
    Weight 530 ± 5g
    Heat Sink 
    Material Aluminum Fins, 4x Heat Pipes with H.C.C. Technology
    Fan
    Dimension Ø92 x 25 mm
    Speed At Duty Cycle 20%: 1000 RPM
    At Duty Cycle 50%: 1800 RPM
    At Duty Cycle 100%: 2500 RPM
    Bearing 2 x Ball
    Rated Voltage 12 V
    Power At Duty Cycle 20%: 0.96 W
    At Duty Cycle 50%: 1.44 W
    At Duty Cycle 100%: 3.0 W
    Air Flow At Duty Cycle 20%: 17.34 CFM
    At Duty Cycle 50%: 31.21 CFM
    At Duty Cycle 100%: 43.36 CFM
    Noise Level At Duty Cycle 20%: 17.0  dBA
    At Duty Cycle 50%: 24.78 dBA
    At Duty Cycle 100%: 31.92 dBA
    Raited Static Pressure At Duty Cycle 20%: 0.48 mm-H2O
    At Duty Cycle 50%: 1.55 mm-H2O
    At Duty Cycle 100%: 3.0 mm-H2O
    Lead Wire Pin Out Pin1-Black (-)
    Pin2-Yellow (+)
    Pin3-Green (Techometer/Signal output)
    Pin4-Blue (PWM)
    1. Supports CPU Power up to 160 Watts
    2. Pre-print thermal compound Shin-Etsu G751
    3. RoHS Compliance
    4. Backplate is not included